Loading...

Newsletter

IISEE Newsletter No.158 issued on Jun 29, 2018

Contents

  • International Conference for the Decade Memory of the Wenchuan Earthquake
  • Reports on Kansai Study Trip of Latin American Earthquake Engineering course
  • Group of executive officer, the Latin American Earthquake Engineering closed
  • YEAR BOOK vol.34 2018

Detail

1. International Conference for the Decade Memory of the Wenchuan Earthquake

By Dr. Takumi Hayashida, Senior Research Scientist, IISEE

Director Yokoi and I participated in the International Conference for the Decade
Memory of the Wenchuan earthquake held on May 12-14 in Chendu, China.

Please see the Newsletter attached on page 1.

2. Reports on Kansai Study Trip of Latin American Earthquake Engineering course

By Ms. Miriam Ventura from El Salvador, and 6 participants.

First of all, we would like to thank JICA, BRI and all those involved in organizing
this study trip, which has given us the valuable knowledge to take into account in our Action Plan.

Please see the Newsletter attached on page 2&3.

By Mr. David GUTIERREZ RIVERA from Honduras, and 4 participants

We want to extend our biggest thanks to JICA, IISEE, and BRI for organizing this expedition.

Please see the Newsletter attached on page 3-5.

3. Group of executive officer, the Latin American Earthquake Engineering closed

By Mr. Yoshihiro Iitake, Head of Administration Division, IISEE

Please see the Newsletter attached on page 5&6.

4. YEAR BOOK vol.34 2018

Please see the Newsletter attached on page 6.

Information

We send this IISEE Newsletter to ex-participants whose e-mail addresses are known. The IISEE send you new information actively and accept your contribution at any time. In order to enlarge our IISEE network, we'd like to ask you to invite your fellow ex-participants whose e-mail addresses are unknown to us to join us. We welcome your comments about the IISEE Newsletter. Please feel free to send us your comments and opinions.

Email: iiseenews@kenken.go.jp
website: https://iisee.kenken.go.jp/en