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Newsletter

IISEE Newsletter No.208 issued on Aug 31, 2022

Contents

  • The 2022 Latin American Course -Enhancement and Dissemination of Earthquake-resistant Technology for Buildings in Latin American Countries- Closed
  • Final Presentation held on August 4th and 5th
  • Holding of Chibikko Hakase
  • Visit to Jakarta, Indonesia

Detail

1. The 2022 Latin American Course -Enhancement and Dissemination of Earthquake-resistant Technology for Buildings in Latin American Countries- Closed

By Mr. Takahiro Yamada, Head of Administration Division, IISEE

The 2022 Latin American course which started on May 12th, 2022 was closed on Friday, July 29th, 2022.

At the online graduation ceremony, all the 10 participants from Colombia(2), Mexico(1), Nicaragua(5), Peru(2) received the certificates

from Ms. Mutsuyoshi, Director general of Japan International Cooperation Agency (JICA) Tsukuba and Dr.Sawachi, the president of Building Research Institute (BRI).

Please see the Newsletter attached on page 1-2.

2. Final Presentation held on August 4th and 5th

By Dr. Bunichiro Shibazaki, Director of IISEE

The final presentations for individual study for the 2021-2022 Regular Course were held on August 4 and 5.

The final presentations were held jointly by the three courses: Seismology, Earthquake Engineering, and Tsunami Disaster Prevention.

Please see the Newsletter attached on page 2-3.

3. Holding of Chibikko Hakase

By Dr. Yuri Otsuka, IISEE Research Engineer

On Wednesday, August 2, IISEE held an open campus event, the Tsukuba Chibikko Hakase 2022 event in Tsukuba City.

Please see the Newsletter attached on page 3.

4. Visit to Jakarta, Indonesia

By Dr. Toshihide Kashima, IISEE Research Engineer

Currently, JICA is implementing a technical cooperation project in Indonesia called “Capacity Development on Operation of Earthquake and Tsunami Analysis and Warning Dissemination.

I visited Jakarta from 24th to 30th July 2022 as a short-term expert for this project.

Please see the Newsletter attached on page 3-4.

Information

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IISEE Newsletter No.208 (Japanese)


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